Rupes Polishing Pad - Coarse

Rupes’ expanded resin foam polishing pads are specially designed for the random orbital polishing system. They produce excellent results with substantial time saving and reduced compound consumption.

BigFoot’s random orbital movement creates high mechanical stresses on the foam polishing pads, generating an increase in internal temperature.

The innovative “open cell” structure of the BigFoot foam polishing pads prevents the build-up of heat generated during the polishing process. This particular structure guarantees maximum efficiency in the polishing process with minimum downward vertical pressure from the operator.

The center hole creates superior ventilation and heat dispersion through special channels in the backing pad. The innovative design of the truncated cone shape optimizes the performance of the large diameter orbit, and at the same time protects against accidental contact between the backing pad and the work surface.

The Coarse Polishing Pad has large dimension of the cells which dissipates any heat build-up , allowing the compounds to work at optimum levels.The oscillating movement of the BigFoot systems is a perfect partner for the porous structure. The abrasive compound is not retained inside the sponge but is continuously applied to the work surface, providing a constant layer of lubricated abrasive between the surface and the foam polishing pad. The use of Zephir abrasive compound is recommended.